exposure technology
Construction: combined inner and outer drum
Light source: 32 or 64 IR diodes, 830 nm, 1 W
Max. Resolution: 2,400 dpi (optionally up to 2,540 dpi)
Plate throughput: k. A.
material handling
Max. Plate format: 900 x 760 mm
minute Plate format: 120 x 120 mm
automat. Plate feed: optional
Online plate development: optional
Inline punch: -
Others
Base area: 241 x 115 cm
Height: 150 cm
RIP: HQ RIP is there
Manufacturer: | Luesher XPose! |
---|---|
Model: | Lüscher Xpose 75 |
Year: | 2003 |
Location: | Germany |
Price: | Log in to see prices |